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소재 및 부속품

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12 Inch (300mm) Wafer

모델명 :
  • - 12" P/N type, Polished silicon wafer
  • - Orientation: 300
  • - Resistivity: 0.1 - 40 ohm•cm
  • - Thickness: 775+/-20um
제품 견적문의

상품상세정보

 12 inch(300mm) Polished Wafer DSC01251 730


12 inch(300mm) Polished Wafer DSC01700 730


MATERIAL PROPERTIES

Parameter

Characteristic

ASTM Control Method

Type/Dopant

P, Boron   N, Phosphorous N, Antimony N, Arsenic

F42

Orientations

<100>,   <111> slice off orientations per customer's specifications

F26

Oxygen   Content

1019 ppmA   Custom tolerances per customer's specification

F121

Carbon   Content

< 0.6   ppmA

F123

Resistivity   ranges- P, Boron- N, Phosphorous- N, Antimony- N, Arsenic

0.001 - 50   ohm cm
  0.1 - 40 ohm cm
  0.005 - 0.025 ohm cm
  < 0.005 ohm cm

F84


MECHANICAL PROPERTIES

Parameter

Prime

Monitor/ Test A

Test

ASTM Method

Diameter

300 ± 0.2   mm

300 ± 0.2   mm

300 ± 0.5   mm

F613

Thickness

775 ± 20   µm (standard)

775 ± 25   µm (standard) 450 ± 25 µm 625 ± 25 µm 1000 ± 25 µm 1300 ± 25 µm 1500 ± 25 µm

775 ± 50   µm (standard)

F533

TTV

< 5 µm

< 10 µm

< 15 µm

F657

Bow

< 30 µm

< 30 µm

< 50 µm

F657

Wrap

< 30 µm

< 30 µm

< 50 µm

F657

Edge   Rounding

SEMI-STD

F928

Marking

Primary   SEMI-Flat only, SEMI-STD Flats Jeida Flat, Notch

F26, F671


SURFACE QUALITY

Parameter

Prime

Monitor/ Test A

Test

ASTM Method

Front   Side Criteria

Surface   condition

Chemical   Mechanical Polished

Chemical   Mechanical Polished

Chemical   Mechanical Polished

F523

Surface   Roughness

< 2 A°

< 2 A°

< 2 A°


Contamination,Particles   @ >0.3 µm

= 20

= 20

= 30

F523

Haze,   Pits, Orange peel

None

None

None

F523

Saw Marks,   striations

None

None

None

F523

Back   Side Criteria

Cracks, crowsfeet,   saw marks,stains

None

None

None

F523

Surface   condition

Caustic   etched

F523

 

【Product description】

Perfect for microfluidics applications. For microelectronics or MEMS applications, please contact us for detailed specs.

 

While semiconductor devices continue to shrink, it is becoming increasingly important for wafers to have high surface quality on both their front and back side. Currently these wafers are most common in microelectromechanical systems (MEMS), wafer bonding, silicon on insulator (SOI) fabrication, and applications with tight flatness requirements. Microelectronics acknowledges the evolution of the semiconductor industry and is committed to finding long term solutions for all customer requirements.

Large stock of double side polished wafers in all wafer diameters ranging from 100mm to 300mm.  If your specification is not available in our inventory, we have established long term relationships with numerous vendors that are capable of custom manufacturing wafers to fit any unique specifications. Double side polished wafers are available in silicon, glass and other materials commonly used in the semiconductor industry.

Customized dicing and polishing is also avaible according to your requirements. Please feel free to contact us.

 

【Product features】

·         12" P/N type, Polished silicon wafer (25 pcs)

·         Orientation: 300

·         Resistivity: 0.1 - 40 ohm•cm (It may vary from batch to batch)

·         Thickness: 775+/-20um

·         Prime/Monitor/Test Grade