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소재 및 부속품

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8 Inch (200mm) Wafer

모델명 :
  • - 8" P/N type, Polished silicon wafer
  • - Orientation: 200
  • - Resistivity: 0.1 - 40 ohm•cm
  • - Thickness: 725+/-20um
제품 견적문의

상품상세정보

【Product introduction】

8 inch(200mm) Polished Wafer DSC01147 730 


8 inch(200mm) Polished Wafer DSC01144 730


MATERIAL PROPERTIES

Parameter

Characteristic

ASTM Control Method

Type/Dopant

P, Boron   N, Phosphorous N, Antimony N, Arsenic

F42

Orientations

<100>,   <111> slice off orientations per customer's specifications

F26

Oxygen   Content

1019 ppmA   Custom tolerances per customer's specification

F121

Carbon   Content

< 0.6   ppmA

F123

Resistivity   ranges- P, Boron- N, Phosphorous- N, Antimony- N, Arsenic

0.001 - 50   ohm cm
  0.1 - 40 ohm cm
  0.005 - 0.025 ohm cm
  < 0.005 ohm cm

F84


MECHANICAL PROPERTIES

Parameter

Prime

Monitor/ Test A

Test

ASTM Method

Diameter

200 ± 0.2   mm

200 ± 0.2   mm

200 ± 0.5   mm

F613

Thickness

725 ± 20   µm (standard)

725 ± 25   µm (standard) 450 ± 25 µm 625 ± 25 µm 1000 ± 25 µm 1300 ± 25 µm 1500 ± 25 µm

725 ± 50   µm (standard)

F533

TTV

< 5 µm

< 10 µm

< 15 µm

F657

Bow

< 30 µm

< 30 µm

< 50 µm

F657

Wrap

< 30 µm

< 30 µm

< 50 µm

F657

Edge   Rounding

SEMI-STD

F928

Marking

Primary   SEMI-Flat only, SEMI-STD Flats Jeida Flat, Notch

F26, F671


SURFACE QUALITY

Parameter

Prime

Monitor/ Test A

Test

ASTM Method

Front   Side Criteria

Surface   condition

Chemical   Mechanical Polished

Chemical   Mechanical Polished

Chemical   Mechanical Polished

F523

Surface   Roughness

< 2 A°

< 2 A°

< 2 A°


Contamination,Particles   @ >0.3 µm

= 20

= 20

= 30

F523

Haze,   Pits, Orange peel

None

None

None

F523

Saw Marks,   striations

None

None

None

F523

Back   Side Criteria

Cracks, crowsfeet,   saw marks,stains

None

None

None

F523

Surface   condition

Caustic   etched

F523

 

【Product description】

Perfect for microfluidics applications. For microelectronics or MEMS applications, please contact us for detailed specs.

 

Microelectronics’ product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. Double side polished wafers are typically required in semiconductor, MEMS, and other applications where wafers with tightly controlled flatness characteristics are required. They are also needed for double side patterning and device manufacturing projects.

Large stock of double side polished wafers in all wafer diameters ranging from 100mm to 300mm.  If your specification is not available in our inventory, we have established long term relationships with numerous vendors that are capable of custom manufacturing wafers to fit any unique specifications. Double side polished wafers are available in silicon, glass and other materials commonly used in the semiconductor industry.

Customized dicing and polishing is also avaible according to your requirements. Please feel free to contact us.

 

【Product features】

·         8" P/N type, Polished silicon wafer (25 pcs)

·         Orientation: 200

·         Resistivity: 0.1 - 40 ohm•cm (It may vary from batch to batch)

·         Thickness: 725+/-20um

·         Prime/Monitor/Test Grade