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Semiconductor packaging UVLED degumming machine

모델명 :
제품 견적문의

상품상세정보

UVLED debonding machine refers to the use of multiple sets of LED chips processed according to a certain proportion and optical principle, and can emit ultraviolet equipment with a surface spot of 310*310mm. The time of this equipment is controllable in real time, and the power density is adjustable. The main wavelengths are 365nm, 385nm, 395nm, 405nm

debonding machine Scope of application:

The UVLED debonding machine solves the debonding process of wafer, glass and ceramic cutting processes. The applicable industries are mainly the semiconductor packaging industry, as well as UV films for semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, integrated circuit boards, mobile hard disks, etc. Degumming use. Most of the UV dissolving machines using UV mercury lamps in the process have the disadvantage of high heat emission, which is easy to damage heat-sensitive materials, and has low efficiency.

debonding machine parameters:

Name

Specification

Unit

Parameter

 

 

 

 

 

UVLED degumming machine

Optional   channel

Channel

CH1,CH2,CH3,CH4

Power settings

mw/cm2

Adjustable   between 0%--100%

 

Irradiation   Mode

Manual mode

Touch,   foot pedal, 0-10V

Automatic mode

Real   time control

Advanced   Mode

Time   and power cycling steps are controllable

Control mode

Four

Touch,foot pedal,0-10V,PLC control, encoder control

Optional   voltage

100-240VAC   50/60HZ

LED type

UV   LED

Wavelength range

nm

365,385,395,405

Luminous size

mm

310*310

Recommended   distance range

mm

30

Irradiation   power range

mw/cm2

45-450

Cooling method

Mandatory

Air cooling

LED life

H

20000-30000

Electric power

W

1000W

Use ambient   temperature/humidity

5±40℃   20-85%

Storage   ambient temperature/humidity

-10±60℃   20-85%

Degumming size

Inch

4/6/8/10

Power cable

Cable

m

2