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DCRF Dual-Head High Vacuum Magnetron Plasma Sputtering System with Thickness Monitor

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DC/RF Dual-Head High Vacuum Magnetron Plasma Sputtering System with Thickness Monitor

CY-VTC-600-2HD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and another RF source for coating non-metallic material. A film thickness tracker is included to enable the user to control processing easily. 

Basic Info

  • Model NO.: CY-VTC-600-2HD
  • Structure: Desktop
  • Certification: CE, TUV
  • Type: Measurement Type
  • RF Source: 600W
  • Gas Flow Control: Mass Flow Meter
  • Trademark: CY
  • Specification: 300 mm Dia x 300 mm height
  • HS Code: 85141090
  • Customized: Customized
  • Material: Stainless Steel
  • Application: Lab
  • DC Source: 500W
  • Vacuum Chamber: Stainless Steel
  • Warranty: One Year
  • Transport Package: Wooden Box
  • Origin: Zhengzhou, China

 

Product Description

Dual-Head Magnetron Plasma Sputtering system  / Magnetron Sputter Coater

CY-VTC-600-2HD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and another RF source for coating non-metallic material. A film thickness tracker is included to enable the user to control processing easily. This coater is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE etc. at low cost. 
 
Specification
 

Input Power

220VAC 50/60Hz, single phase
2000W (including pump)

Source Power

Two sputtering power sources are integrated into one control box
DC source: 500W for coating metallic materials
RF source: 600W with automatching for coating non-metallic materials ( Center)
Compact 300 RF source is available at extra cost

Magnetron Sputtering Head

Two 2" Magnetron Sputtering Heads with water cooling jackets are included
One is connected to RF power supply for no-conductive materials
Another is connected to DC sputtering power source for coating metallic materials
Target size requirement: 2" diameter
Thickness Range: 0.1 - 5 mm for both metallic and non-conductive targets
One stainless steel and one Al2O3 ceramic targets are included for demo testing
Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering heads
Customized coater: Two DC head without, RF sputtering, RF head without DC sputtering, 3 RF head are available upon request

Vacuum
Chamber

Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel
Observation Window: 100 mm diameter
Hinged type cover on top with air spring sport makes target exchange easy

Sample Holder

Sample holder size: 140mm dia. for. 4" wafer max 
(also can be designed as your requirement)
Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating
The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C

Gas Flow
Control

Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in
Flow rate: 200 ml/min max.
Flow rate is adjustable on the 6" touch screen control panel

Vacuum Pump
Station

High speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum level
Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed
Mobile pump station is included and the compact sputtering coater can be put on top of station
Max. vacuum level: 10^-6 torr with chamber baking

Thickness
Monitor

One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å
LED Display Unit outside chamber can:5 pcs quartz sensors (consumable) are included
Input material to be coated according to data base included
Display total thickness coated and coating speed
Water cooling is required

Overall
Dimensions

L1300mm× W660mm× H1200mm

Net Weight

160 kg

Warranty

One years limited warranty with lifetime support

Application Note

In order to remove oxygen from the chamber, suggest you use 5% Hytrogen + 95 % Nitrogen to clan chamber 2-3 times, which can reduce oxygen to below 10 ppm
Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O