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DCRF Dual-Head High Vacuum 2 Magnetron Plasma Sputtering Coater

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DC/RF Dual-Head High Vacuum 2" Magnetron Plasma Sputtering Coater

CY-VTC-600-2HD is a compact magnetron sputtering system with dual 2"  target sources, e.g., one DC source for coating metallic film, and another RF source for coating non-metallic material. A film thickness tracker is included to enable the user to control processing easily.

Basic Info

  • Model NO.: CY-VTC-600-2HD
  • Coating: Plasma Sputtering Coater
  • Certification: CE
  • Product Name: DC/RF Dual-Head Magnetron Plasma Sp
  • RF Source: 300W
  • Transport Package: Wooden Case
  • Origin: China
  • Type: Coating Production Line
  • Substrate: Ceramic and Metal
  • Condition: New
  • DC Source: 500W
  • Trademark: CYKY
  • Specification: plasma sputtering system

 

Product DescriptionDC/RF Dual-Head High Vacuum 2" Magnetron Plasma Sputtering Coater
 
CY-VTC-600-2HD is a compact magnetron sputtering system with dual 2"  target sources, e.g., one DC source for coating metallic film, and another RF source for coating non-metallic material. A film thickness tracker is included to enable the user to control processing easily. This coater is designed for coating both single or multiple film layers for a wide range of  materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE  etc.  at low cost.
 
Specification of the dual head magnetron plasma sputtering coater
 

Input Power

220VAC 50/60Hz, single phase
2000W (including pump)




Source Power

Two sputtering power sources are integrated into one control box 
DC source: 500W for coating metallic materials 
RF source: 300W for coating non-metallic materials








Magnetron Sputtering Head

Two 2" Magnetron Sputtering Heads with water cooling jackets are included
One is connected to RF source for non-conductive materials
The other one is connected to DC source for coating metallic materials
Target size requirement: 2" diameter
Thickness Range: 0.1 - 5 mm for both metallic and non-conductive targets (including backing plate)
One Cu and one fused SiO2 targets are included for demo testing
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  • Customized coater: Two DC heads without RF sputtering; two RF heads without DC sputering; 3 RF head are available upon request
  • Optional: 148 cm RF cable is replaceale with extra cost

Vacuum Chamber

Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel
Observation Window: 100 mm diameter
Hinged type lid on top with pneumatic power pole makes target exchange easily




Sample Holder

Sample holder size: 140mm dia. for. 4" wafer max
Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating
The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C

Gas Flow Control
 

Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in
Flow rate: 200 ml/min max. (0-200 SCCM)
Flow rate is adjustable on the 6" touch screen control panel

Vacuum Pump Station
 

High speed turbo vacuum pump (made in Germany) is directly installed on the vacuum chamber for max. vacuum level 
Heavy duty dual stage mechanical pump, 220 liters/minute (7.8CFM) is connected to turbo pump for faster pumping speed
Mobile pump station is included and the compact sputtering coater can be placed on top of station
Standard Vacuum Level: < 4x10^-5 Torr . Max. vacuum level: 10^-6 torr with chamber baking

Water Chiller
 

One Digital Temperature Controlled Recirculating Water Chiller is included for cooling both magnetron sputtering heads.
Refrigeration range : 5~35°C
Floowing Rate: 16L/minute



Optionals

Precise quartz Film Thickness Monitor is available upon reuqest to built into the chamber to monitor coating thickness with accuracy 0.10 Å.
Pricesion Thin Film & Coating Analysis Systems with Measurement Capability is available for measure film thickness after coating.


Overall Dimensions


Lid closed: 48" × 28" × 32" Lid open: 48" × 28" × 37"

Net Weight

200 kg

Warranty

One years limited warranty with lifetime support