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Magnetron sputteringvacuum evaporation composite coating equipment CY-MSE300S-DC
The magnetron sputtering/vacuum evaporation
composite coating equipment combines magnetron sputtering technology and vacuum
evaporation technology in one coating equipment. In this device, magnetron
sputtering cathode glow discharge is used to sputter the target atoms and
partially ionize and deposit them on the substrate to form a film, and at the
same time, the metal plating material can be melted in a vacuum by resistance
heating and vaporized and then deposited on the substrate to form a film. This
increases the utility and flexibility of the device. The equipment is used for
metallization of plastic surface such as mobile phone case and deposition of
non-conductive film and electromagnetic shielding film.
The magnetron sputtering/vacuum evaporation
composite coating equipment is equipped with a plasma processing device, a
high-efficiency magnetron sputtering cathode and a resistance evaporation
device, etc. The deposition rate of this device is fast, the coating adhesion
is good, the plating layer is fine and compact, the surface finish is high, the
uniformity and consistency is good; the machine realizes full automatic control
of coating process, large load, reliable work, high qualification rate, low production
cost and green environmental protection.
Magnetron sputtering/vacuum evaporation
composite coating equipment application:
The device is widely used in computer
casings, mobile phone cases, household appliances and other industries, and can
be coated with metal film, alloy film, composite film layer, transparent
(translucent) film, non-conductive film, electromagnetic shielding film and the
like.
Magnetron sputtering/vacuum evaporation
composite coating equipment specifications:
Product Model |
Magnetron sputtering/vacuum
evaporation composite coating equipment CY-MSE300S-DC |
||
Sample stage |
Size |
Φ185mm |
|
Temperature control accuracy |
±1℃ |
||
Rotating speed |
1-20rpm adjustable |
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Sputter current |
2~20mA |
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Sputter voltage |
1000V |
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Evaporation source |
Tungsten wire basket |
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Maximum temperature |
1700℃ |
||
Precise temperature control |
30-segment lifting and lowering
temperature program can be set |
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Vacuum chamber |
Chamber size |
φ300mm × 300mm |
|
Watch window |
φ100mm |
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Chamber material |
Stainless steel |
||
Opening method |
Top over open |
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Film thickness monitor |
Monitoring components |
Power supply |
DC 5V (±10%), maximum current 400mA |
Frequency resolution |
±0.03Hz |
||
Film thickness resolution |
0.0136Å (aluminum) |
||
Film thickness accuracy |
±0.5%, depending on process conditions,
especially sensor position, material stress, temperature and density |
||
Measuring speed |
100ms-1s/times, settable |
||
Measuring range |
500000Å (aluminum) |
||
Standard sensor crystal |
6MHz |
||
Computer interface |
RS-232/485 serial interface (baud
rate 1200, 2400, 4800, 9600, 19200, 38400 can be set, data bit: 8,
stop bit: 1, check: none) |
||
Analog output |
8-bit resolution, PWM pulse width
modulated output (open collector or internal 5V output) |
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Working environment |
Temperature 0-50℃, humidity 5%-85% RH, no
condensation beads |
||
Displayer |
Input power |
AC 220V±10% |
|
Output power |
DC 5V 3A |
||
Displayer |
12×2 digital tube and LED |
||
Communication port |
RS-485 (baud rate 1200, 2400,
4800, 9600, 19200, 38400 can be set, data bit: 8 bits, stop bit: 1
bit, parity: none) |
||
Probes |
Applicable wafer frequency |
6MHz |
|
Applicable wafer size |
Φ14mm |
||
Mounting flange |
CF35 |
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Cooling water pipe |
Φ3mm, length 00mm, 500mm, 1000mm |
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Cooling water pressure |
<0.3MPa |
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Pneumatic baffle pipe |
Φ3mm |
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Baking temperature |
Water supply state <200℃, water-free
state flange <100℃ |
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Electrical Interface |
BCN socket |
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Mass flowmeter |
2 channels; measuring range 100sccm;
100sccm (can be customized according to customer needs) |
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Vacuum system |
Model |
CY-GZK103-A |
|
Pumping interface |
KF40 |
||
Molecular pump |
CY-600 |
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Exhaust interface |
KF16 |
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Backing pump |
Rotary vane pump |
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Vacuum measurement |
Compound vacuum gauge |
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Ultimate vacuum |
1.0E-5Pa |
||
Power supply |
AC;220V 50/60Hz |
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Pumping rate |
Molecular pump: 600L/S rotary vane pump:
1.1L/S Comprehensive pumping performance: The vacuum can reach 1.0E-3Pa in 20
minutes. |
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Optional accessories |
Various targets such as gold, indium,
silver, and platinum |
||
Warranty |
One year warranty, lifetime technical
support. |