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Diamond Double Side Polishing machine

모델명 :
제품 견적문의

상품상세정보

Diamond Double Side Polishing machine Feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance.

Diamond Double Side Polishing machine Application:

• Sapphire Substrate / Wafer

• Semiconductor Wafer

• Tungsten Carbide Parts

• Ceramic Parts

• Valves

• Crystal Glass

• Oscillator Parts

technical parameter:

Items

SSP-36DPAW

SSP-50DPAW

Polishing plate

Plate material

Oxygen free Cu , Resin-Cu

Oxygen free Cu

Or Tin plate (*option)

or Tin plate(*option)

Plate size

Φ910mm

Φ1240mm

Revolution control

By inverter.

Home position.

Plate cooling

Cooling water jacket

Cooling water jacket

Pressure plate

P. Plate

4 axles.

4 axles.
  (driving force system individually)

Block size

360mmΦ

485mmΦ

Applied pressure

By cylinder

By cylinder

Work block

-

Auto Centering

Facing unit

Mounting type.

Square type.

Capacity / batch

4 inch wafer x 24 Pcs

4 inch wafer x 40 Pcs

6 inch wafer x 12 Pcs

6 inch wafer x 24 Pcs

Utility

Electricity

AC220V, 3Phase, 60Hz

AC220V, 3Phase, 60Hz

Pneumatic

0.5~0.8 Mpa

0.5~0.8 Mpa

Etc

Machine Size

1350 *2250 *1920 mm

1640 *3029 *2575 mm

Machine Weight

3,500Kg.

5,500Kg.

Controller

Touch Screen (Proface)

Touch Screen (Proface)

Signal lamp with alarm