Smile, Smart, Speed

고객의 만족을 위하여 최선을 다하는 기업, 정문사이언스입니다.

공정장비

HomeHOME > 회사소개 >공정장비

diamond Single Side Polishing machine

모델명 :
제품 견적문의

상품상세정보

CYKY diamond Single Side Lapping/Polishing machines SSP-50DPAW feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance.

diamond Single Side Lapping Application:

• Sapphire Substrate / Wafer

• Semiconductor Wafer

• Tungsten Carbide Parts

• Ceramic Parts

• Valves

• Crystal Glass

• Oscillator Parts

technical parameter:

Items

SSP-36DPAW

SSP-50DPAW

Polishing plate

Plate material

Oxygen free Cu , Resin-Cu

Oxygen free Cu

Or Tin plate (*option)

or Tin plate(*option)

Plate size

Φ910mm

Φ1240mm

Revolution control

By inverter.

Home position.

Plate cooling

Cooling water jacket

Cooling water jacket

Pressure plate

P. Plate

4 axles.

4 axles.
  (driving force system individually)

Block size

360mmΦ

485mmΦ

Applied pressure

By cylinder

By cylinder

Work block

-

Auto Centering

Facing unit

Mounting type.

Square type.

Capacity / batch

4 inch wafer x 24 Pcs

4 inch wafer x 40 Pcs

6 inch wafer x 12 Pcs

6 inch wafer x 24 Pcs

Utility

Electricity

AC220V, 3Phase, 60Hz

AC220V, 3Phase, 60Hz

Pneumatic

0.5~0.8 Mpa

0.5~0.8 Mpa

Etc

Machine Size

1350 *2250 *1920 mm

1640 *3029 *2575 mm

Machine Weight

3,500Kg.

5,500Kg.

Controller

Touch Screen (Proface)

Touch Screen (Proface)

Signal lamp with alarm