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고객의 만족을 위하여 최선을 다하는 기업, 정문사이언스입니다.
고객의 만족을 위하여 최선을 다하는 기업, 정문사이언스입니다.
Precision Auto Lapping and Polishing Machine with Two Work Stations
Basic Info
Product Description
8" Precision Auto Lapping and
Polishing Machine with two work stations
Introduction
This machine is equipped with 8" super flat lapping plate and can be used
as a high precision lapping machine for polishing crystal components,
semiconductor wafers, and ceramic substrates up to 3" in diameter. It can
be used as a standard grinding and polishing machine for preparing
metallographic samples as well. Combining with flat sample holder (included),
the three-hole metallographic sample holder (optional), and precision thinning
fixture (optional), the machine can lap and polish various samples
automatically.
Specification
Power |
AC 110V and 208-240V (50/60Hz)
switchable for worldwide operation. |
Features |
One cast iron plate for lapping
and one cast aluminum plate for polishing. |
Super-Flat 8" Lapping Plate |
Flatness < 2.5 micron / inch² |
Precision Rotating Shaft |
Running Off < 5 micron |
Aluminum Case |
Heavy Duty Cast with Bright Painting |
Two Work Stations Rocking Speed |
8° Rocking with adjustable speed
of 0 - 20 rocking / minute |
Two Flat Sample Holders |
80 Dia. x 35 T mm for carrying
<3" diameter wafer |
Two Condition Rings |
95 O.D. x 88 I.D. x 32 T mm |
Master Plate Speed Range |
0 ~125 rpm variable with
digital display |
Operation Timer |
0 - 99 hours |
Motor |
300 W high torque DC motor |
Dimensions |
525 L x 350 W x 325 H (mm) |
Net Weight |
120 lbs |
Optional Parts |
Automatic Slurry Feeder |
Warranty |
One year limited with lifetime support |