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Fully automatic diamond wire cutting machine for cutting crystal materials

모델명 : CY-DWC-M808
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CY-DWC-M808 fully automatic diamond wire cutting machine is suitable for cutting materials of different hardness, such as ceramics, crystals, glass, metals, rocks, thermoelectric materials, infrared optical materials, composite materials and biomedical materials. It is mainly used for processing large-sized precious materials, and the cutting size can reach 8".

CY-DWC-M808 fully automatic diamond wire cutting machine is particularly suitable for cutting large-sized samples. It can also be used for cutting seed crystals of artificial crystal materials such as silicon, white sapphire, and sapphire, as well as for square cutting of silicon crystals and sapphire crystals. When used for slicing precious gemstones and biological plastic specimens, not only the cutting seams are small, but also the quality of the cutting discs is excellent, which greatly improves the utilization rate of materials.

CY-DWC-808 fully automatic diamond wire cutting machine is a continuous cutting diamond wire cutting machine. After setting the cutting program, the sample is continuously fed without manual operation. Adjustment, the sample size after cutting has high precision within the range of ±10μm.

The cutting wire of the CY-DWC-M808 fully automatic diamond wire cutting machine adopts a single wire reciprocating motion mode, the usable wire length is long (≤150m), and the service life of the wire is long, which greatly improves the cutting efficiency. The tensioning wheel adopts a pneumatic tensioning mode, and the air pressure can be adjusted according to the thickness of the wire diameter. When the wire diameter used is too thin, it can effectively protect the cutting wire from breaking due to excessive tension. This machine is particularly suitable for cutting large samples, especially samples over 8", and is the only choice for slicing large samples.

Technical parameters of diamond wire cutting machine:

Product name

Fully automatic diamond wire cutting   machine

Product model

CY-DWC-M808

Technical parameters

Power supply

220V 50Hz

Power

<1.5KW（max）

Spindle motor

Servo motor, power 750W

Y, Z axis motor

Precision stepper motor

Cutting wire feeding speed

0-8m/s adjustable, digital display

Cutting wire total length

≤150m

Cutting wire diameter

≤0.35mm

Y axis travel

≤200mm，digital   display

Z axis travel

≤200mm，digital   display

Y, Z axis feed indication accuracy

0.01mm

Workbench rotation angle

0-360˚

Cutting sample size

Ø200mm×200mm（max）

Tensioning system

Pneumatic tensioning, tensioning air   pressure adjustment range 0-0.7Mpa

Safety control device

Automatic stop when wire breaks,   emergency stop switch

Tensioning wheel

2 piece

Technical parameters

Guide wheel

2 piece

Diamond wire

2 volume

Water pump

1 piece

Resin ceramic block

2 piece

Paraffin rod

4 piece

Diamond wire

（Ø0.125mm、Ø0.25mm、Ø0.35mm、Ø0.42mm）

Optional accessories

Special cutting oil

CY-1200-YB Wire Cutting Machine Swing   Mechanism (especially suitable for cutting high-hardness materials such as   gemstones, jade, etc., or low-hardness graphite, KDP, etc.)

CY-1200-A Axis Swing Rotation Mechanism   (especially suitable for cutting high-hardness materials such as jade, etc.)

Heating Platform

Silent Oil-free Air Compressor

DX-100 Single Crystal Orientation   Instrument

Optional accessories

600mm×700mm×1500mm

Optional accessories

约300kg

Optional accessories

1. Cutting size can reach 8". (max)

2. The main motor drives the diamond   cutting wire to move downward at a constant speed, and the material is fixed   on the workbench to ensure stable cutting.

3. The workbench can be rotated 360°   manually or through program control.

4. The pneumatic tensioning system uses   imported pneumatic components to make the tensioning force more stable and   reliable.

5. The PLC program control system and   large-size touch screen make the operation simple and fast.

6. Various tooling fixtures can be   designed according to your needs.

Functions and uses

Ceramic materials

Alumina ceramics, zinc oxide ceramics,   zirconium oxide ceramics, target ceramics, honeycomb ceramics, semiconductor   ceramics, conductive ceramics, non-conductive ceramics, etc.;

Crystal materials

Graphite, silicon crystals (solar   polysilicon, single crystal silicon), sapphire, alumina crystals, infrared   glass crystals, alumina crystals, silicon carbide crystals, cesium iodide   crystals, etc.

Glass materials

Chalcogenide glass, optical glass, quartz   glass, infrared glass, glass tubes, etc.

Metal materials

Metals and alloys such as iron, aluminum,   copper, titanium alloy, magnesium alloy, non-ferrous metals (zinc sulfide,   ferrite), etc.

Composite materials

PVC boards, carbon fiber composites,   glass fiber composites, etc.

Rock materials

Precision cutting of natural rocks, jade,   meteorites, Pei Cui, agate, etc., and precision slicing of various high-value   materials; square slicing of geological light slices, geological thin slices   (sedimentary rocks, igneous rocks, metamorphic rocks, ores), etc.

Thermoelectric materials

Bismuth telluride, lead telluride,   silicon-germanium alloy, etc.

Infrared optical materials

Crystals such as zinc selenide, zinc sulfide,   silicon, germanium, etc.

Biomedical materials

Bioplasted specimen slicing (human and   animal organs, combined slices of hard and soft tissues of the jaw, implant   observation, dental crowns and bridges, and histological specimens such as   teeth) ; Orthopedic soft and hard tissue sections (fresh and hard tissues   such as femur, hip joint, vertebral body, bone histology samples with   implants, etc.); Cardiovascular stent sections, stone sections and other   medical tissue sections;