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고객의 만족을 위하여 최선을 다하는 기업, 정문사이언스입니다.
고객의 만족을 위하여 최선을 다하는 기업, 정문사이언스입니다.
Split type High Vacuum Dual-Target Magnetron Sputtering Coating Machine
The dual-target magnetron sputtering
coating machine is a cost-effective magnetron sputtering coating equipment
independently developed by our company, featuring standardization,
modularization, and customizability. The magnetron targets are available in
1-inch and 2-inch options, allowing customers to choose based on the size of
the substrate to be coated. Equipped with two 500W DC power supplies, this
machine is suitable for preparing metal films, and the two targets cater to the
needs of multi-layer or multiple coating processes.
The coating machine is equipped with two
high-precision mass flow controllers, and customers can customize up to four
MFCs for gas paths to meet complex gas environment construction requirements.
The instrument comes standard with an advanced turbo molecular pump set,
capable of achieving an ultimate vacuum of 1.0E-5Pa. Additionally, other types
of molecular pumps are available for selection. The gas path of the molecular
pump is controlled by multiple solenoid valves, enabling the opening of the
chamber and retrieval of samples without turning off the pump, significantly
enhancing your work efficiency. Optionally, an all-in-one industrial control
computer can be equipped to control the system, allowing for the majority of
functions, such as the control of vacuum pump sets and sputtering power
supplies, to be executed through computer programs, further boosting your
experimental efficiency.
Application Range:
The dual-target magnetron sputtering coating machine is suitable for
preparing single-layer or multi-layer ferroelectric films, conductive films,
alloy films, etc. Compared to similar equipment, it boasts a wide range of
applications while being compact and easy to operate, making it an ideal device
for preparing material films in laboratories.
Technical Specifications:
Technical specifications of the dual-target magnetron sputtering coating
machine:
Product name |
Split type High Vacuum Dual-Target
Magnetron Sputtering Coating Machine |
|
Product model |
CY-MSV325-II-DCDC-SS |
|
Power supply voltage |
AC220V,50Hz |
|
Complete power |
6KW |
|
System vacuum |
≦5×10-4Pa |
|
Sample stage |
Dimensions |
φ150mm |
Heating temperature |
≦600℃ |
|
Temperature control accuracy |
±1℃ |
|
Adjustable speed |
≦20rpm |
|
Magnetic target gun |
Target size |
Diameter Φ50.8mm, thickness ≤3mm |
Cooling mode |
Circulating water cooling |
|
Water flow size |
Not less than 10L/Min |
|
Quantity |
2 |
|
Vacuum chamber |
Cavity size |
Diameter φ325mm, height 500mm |
Cavity material |
SUU304 stainless steel |
|
Observation window |
Diameter φ100mm |
|
Opening method |
Top opening |
|
Gas control |
1 mass flow meter is used to control the
Ar flow, with a range of 200SCCM |
|
Vacuum system |
Equipped with 1 molecular pump system,
gas pumping speed 600L/S |
|
Film thickness measurement |
Optional quartz crystal film thickness
meter, resolution 0.10 Å |
|
Sputtering power supply |
Equipped with DC power supply, power
500W*2 |
|
Control system |
CYKY self-developed professional control
system |
|
Equipment dimensions |
540mm×540mm×1000mm |
|
Equipment weight |
145kg |