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Vacuum magnetron sputtering system

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Vacuum magnetron sputtering system

Vacuum magnetron sputtering system is used for the preparation of novel thin film materials such as nanometer single-layer and multi-layer functional film, hard film, metal film, semiconductor film and dielectric film. It can be widely used in the research and production of thin film materials in colleges and universities.

Vacuum magnetron sputtering system specifications:

Vacuum chamber  

Cylindrical front opening structure, size dia. 450×400mm

Vacuum system configuraition

Compound molecular pump, mechanical pump, pneumatic gate valve, imported SMC cylinder throttle valve

Ultimate pressure

≤6.6*10-6 Pa(after baking and degassing)

Vacuum recovery system

It can reach 6.6x10-4pa in 25 minutes(start pumping after short exposure to air and filled with dry helium)

Magnetron target unit

Three sets of permanent magnetic target; target size dia. 60mm (one of those can be used for sputtering ferromagnetism materials); Each   target rf sputtering is compatible with dc sputtering.Water cooling within the target; The sample centers of the three targets can fold upward together. The distance between target and sample is adjustable from 90 to 130mm. Each target is equipped with imported SMC rotary pneumatic baffle

Single substrate heating table

Sample size

dia. 4 inches

Mode of motion

Substrate rotates continuously, rotation speed 0-30 rpm

Heating

Heated by imported heating wire, max heating temperature 600℃±1℃

Battle format

Imported SMC angle air cylinder control

Gas circuit system

2-circuit mass flow controller

Computer control system

Fully automated control by PLC+IPC+touch screen

Optional accessories

Film thickness gauge, air pump, cooling water circulator

Floor Space

Main unit

1000×1800mm2

Electric cabinet

900×600mm2